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等离子溅射复合刻蚀 的英文翻译: pse ; plasma sputter combined etching |
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1. 等离子溅射复合刻蚀 plasma sputter combined etching 2. 等离子刻蚀设备 plasma etching equipment 3. 等离子干法刻蚀 dry plasma etching 4. 等离子溅射设备 plasma sputtering equipment 5. 脉冲等离子溅射的应用 Pulsed plasmas for sputtering applications 6. 介绍感应耦合等离子(ICP)的刻蚀原理 The etching principle of inductive couple plasmas was introduced in this paper. 7. 介绍了一种用于真空镀膜的等离子溅射高频PWM电源 Introduces a high-frequency PWM power supply used for vacuum ion sputtering film deposition. 8. 感应耦合等离子刻蚀(ICP)以及硅的各向异性刻蚀等。 inductively coupled plasma (ICP) etch and anisotropic etch of silicon. 9. 讨论了低温与离子刻蚀、负偏压、磁场强度3个主要溅射工艺参数的关系 A series of experiments were conducted to study the relationship between low temperature and three major sputtering technological parameters 10. 等离子体辉光溅射反应复合渗镀合成TiN的研究 Growth of TiN by Plasma Glow Discharge Sputtering, Diffusion and Ion Surface Alloying 11. 由氩离子溅射深度刻蚀和X射线光电子能谱(XPS)检测出结合强度差的镀层和基体间界面含氧层的存在。 The combinationof Ar ion sputtering and X radial photoelectron spectra may measure the existence ofoxygen layerbetween copper coating and iron substrate. 12. 通过种子层溅射/光刻/电镀Cu/刻蚀种子层的方法完成了Cu线圈的电镀。 The copper coils are formed with the processing method of seed layer sputtering / lithography / copper electroplating / seed layer etching. |
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